Details
- Title: 2021 International Conference on Platform Technology and Service (PlatCon 2021)
- Date/Location: Held 23-25 August 2021, Jeju, South Korea.
- IEEE #: CFP21B77-POD
- ISBN: 9781665417679
- Pages: 57 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2022 )
Description
Members/Attendees
Tab 4
- Title: 2021 International Conference on Platform Technology and Service (PlatCon 2021)
- Date/Location: Held 23-25 August 2021, Jeju, South Korea.
- IEEE #: CFP21B77-POD
- ISBN: 9781665417679
- Pages: 57 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2022 )