Details
- Title: 2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME 2021)
- Date/Location: Held 27-30 October 2021, Timisoara, Romania.
- IEEE #: CFP2107I-POD
- ISBN: 9781665494472
- Pages: 391 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2022 )
Description
Members/Attendees
Tab 4
- Title: 2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME 2021)
- Date/Location: Held 27-30 October 2021, Timisoara, Romania.
- IEEE #: CFP2107I-POD
- ISBN: 9781665494472
- Pages: 391 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2022 )