Details
- Title: 2021 Computing, Communications and IoT Applications (ComComAp 2021)
- Date/Location: Held 26-28 November 2021, Shenzhen, China.
- IEEE #: CFP2121R-POD
- ISBN: 9781665427999
- Pages: 366 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2022 )
Description
Members/Attendees
Tab 4
- Title: 2021 Computing, Communications and IoT Applications (ComComAp 2021)
- Date/Location: Held 26-28 November 2021, Shenzhen, China.
- IEEE #: CFP2121R-POD
- ISBN: 9781665427999
- Pages: 366 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2022 )