Details
- Title: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2021)
- Date/Location: Held 23 September 2021, Berlin, Germany.
- IEEE #: CFP21TII-POD
- ISBN: 9781665418973
- Pages: 243 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2022 )
Description
Members/Attendees
Tab 4
- Title: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2021)
- Date/Location: Held 23 September 2021, Berlin, Germany.
- IEEE #: CFP21TII-POD
- ISBN: 9781665418973
- Pages: 243 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2022 )