Details
- Title: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2021)
- Date/Location: Held 15 September - 15 October 2021, Singapore.
- IEEE #: CFP21777-POD
- ISBN: 9781665439893
- Pages: 474 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2022 )
Description
Members/Attendees
Tab 4
- Title: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2021)
- Date/Location: Held 15 September - 15 October 2021, Singapore.
- IEEE #: CFP21777-POD
- ISBN: 9781665439893
- Pages: 474 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2022 )