Details
- Title: 2021 IEEE Engineering International Research Conference (EIRCON 2021)
- Date/Location: Held 27-29 October 2021, Lima, Peru.
- IEEE #: CFP21Y79-POD
- ISBN: 9781665444460
- Pages: 144 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2022 )
Description
Members/Attendees
Tab 4
- Title: 2021 IEEE Engineering International Research Conference (EIRCON 2021)
- Date/Location: Held 27-29 October 2021, Lima, Peru.
- IEEE #: CFP21Y79-POD
- ISBN: 9781665444460
- Pages: 144 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2022 )