Details
- Title: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2021)
- Date/Location: Held 5-11 October 2021, Virtual Conference.
- IEEE #: CFP2118S-POD
- ISBN: 9781665405683
- Pages: 53 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2022 )
Description
Members/Attendees
Tab 4
- Title: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2021)
- Date/Location: Held 5-11 October 2021, Virtual Conference.
- IEEE #: CFP2118S-POD
- ISBN: 9781665405683
- Pages: 53 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2022 )