Details
- Title: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC 2021)
- Date/Location: Held 13-16 September 2021, Gothenburg, Sweden.
- IEEE #: CFP2154H-POD
- ISBN: 9781665423687
- Pages: 402 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2021 )
Description
Members/Attendees
Tab 4
- Title: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC 2021)
- Date/Location: Held 13-16 September 2021, Gothenburg, Sweden.
- IEEE #: CFP2154H-POD
- ISBN: 9781665423687
- Pages: 402 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2021 )