Details
- Title: 2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2021)
- Date/Location: Held 25-27 August 2021, Paris, France.
- IEEE #: CFP21DTI-POD
- ISBN: 9781665402316
- Pages: 146 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2021 )
Description
Members/Attendees
Tab 4
- Title: 2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2021)
- Date/Location: Held 25-27 August 2021, Paris, France.
- IEEE #: CFP21DTI-POD
- ISBN: 9781665402316
- Pages: 146 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2021 )