Details
- Title: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT 2021)
- Date/Location: Held 14-17 September 2021, Xiamen, China.
- IEEE #: CFP21553-POD
- ISBN: 9781665413923
- Pages: 1,532 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2021 )
Description
Members/Attendees
Tab 4
- Title: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT 2021)
- Date/Location: Held 14-17 September 2021, Xiamen, China.
- IEEE #: CFP21553-POD
- ISBN: 9781665413923
- Pages: 1,532 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2021 )