Details
- Title: 2021 IEEE Hot Chips 33 Symposium (HCS 2021)
- Date/Location: Held 22-24 August 2021, Palo Alto, California, USA.
- IEEE #: CFP21HCS-POD
- ISBN: 9781665413985
- Pages: 531 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2021 )
Description
Members/Attendees
Tab 4
- Title: 2021 IEEE Hot Chips 33 Symposium (HCS 2021)
- Date/Location: Held 22-24 August 2021, Palo Alto, California, USA.
- IEEE #: CFP21HCS-POD
- ISBN: 9781665413985
- Pages: 531 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2021 )