Details
- Title: 2021 IEEE International Conference on Decentralized Applications and Infrastructures (DAPPS 2021)
- Date/Location: Held 3-6 August 2021, Virtual Conference.
- IEEE #: CFP21S63-POD
- ISBN: 9781665434867
- Pages: 111 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2021 )
Description
Members/Attendees
Tab 4
- Title: 2021 IEEE International Conference on Decentralized Applications and Infrastructures (DAPPS 2021)
- Date/Location: Held 3-6 August 2021, Virtual Conference.
- IEEE #: CFP21S63-POD
- ISBN: 9781665434867
- Pages: 111 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2021 )