Details
- Title: 2021 Third International Conference on Transdisciplinary AI (TransAI 2021)
- Date/Location: Held 20-22 September 2021, Laguna Hills, California, USA.
- IEEE #: CFP21S76-POD
- ISBN: 9781665434133
- Pages: 157 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2021 )
Description
Members/Attendees
Tab 4
- Title: 2021 Third International Conference on Transdisciplinary AI (TransAI 2021)
- Date/Location: Held 20-22 September 2021, Laguna Hills, California, USA.
- IEEE #: CFP21S76-POD
- ISBN: 9781665434133
- Pages: 157 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2021 )