ELECTRONICS, ELECTRICAL ENGINEERING AND COMPUTING. IEEE INTERNATIONAL CONFERENCE. 28TH 2021. (INTERCON 2021)

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060372
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Details

  • Title: 2021 IEEE XXVIII International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2021)
  • Date/Location: Held 5-7 August 2021, Lima, Peru.
  • IEEE #: CFP21D62-POD
  • ISBN: 9781665429719
  • Pages: 292 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Oct 2021 )

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Tab 4

 
  • Title: 2021 IEEE XXVIII International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2021)
  • Date/Location: Held 5-7 August 2021, Lima, Peru.
  • IEEE #: CFP21D62-POD
  • ISBN: 9781665429719
  • Pages: 292 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Oct 2021 )