Details
- Title: 2021 IEEE XXVIII International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2021)
- Date/Location: Held 5-7 August 2021, Lima, Peru.
- IEEE #: CFP21D62-POD
- ISBN: 9781665429719
- Pages: 292 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2021 )
Description
Members/Attendees
Tab 4
- Title: 2021 IEEE XXVIII International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2021)
- Date/Location: Held 5-7 August 2021, Lima, Peru.
- IEEE #: CFP21D62-POD
- ISBN: 9781665429719
- Pages: 292 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2021 )