Details
- Title: 2021 IEEE International Conference on Robotics, Automation and Artificial Intelligence (RAAI 2021)
- Date/Location: Held 21-23 April 2021, Hong Kong.
- IEEE #: CFP21AD3-POD
- ISBN: 9781665430883
- Pages: 87 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2021 )
Description
Members/Attendees
Tab 4
- Title: 2021 IEEE International Conference on Robotics, Automation and Artificial Intelligence (RAAI 2021)
- Date/Location: Held 21-23 April 2021, Hong Kong.
- IEEE #: CFP21AD3-POD
- ISBN: 9781665430883
- Pages: 87 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2021 )