THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. IEEE INTERSOCIETY CONFERENCE. 20TH 2021. (iTherm 2021) (2 VOLS)

THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. IEEE INTERSOCIETY CONFERENCE. 20TH 2021. (iTherm 2021) (2 VOLS)

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059975
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Details

  • Title: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm 2021)
  • Date/Location: Held 1-4 June 2021, San Diego, California, USA.
  • IEEE #: CFP21ITH-POD
  • ISBN: 9781728185408
  • Pages: 1,267 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Sep 2021 )

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Tab 4

 
  • Title: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm 2021)
  • Date/Location: Held 1-4 June 2021, San Diego, California, USA.
  • IEEE #: CFP21ITH-POD
  • ISBN: 9781728185408
  • Pages: 1,267 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Sep 2021 )