Details
- Title: 2021 Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2021)
- Date/Location: Held 21-23 June 2021, Osaka, Japan.
- IEEE #: CFP21G64-POD
- ISBN: 9781728163178
- Pages: 37 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2021 )
Description
Members/Attendees
Tab 4
- Title: 2021 Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2021)
- Date/Location: Held 21-23 June 2021, Osaka, Japan.
- IEEE #: CFP21G64-POD
- ISBN: 9781728163178
- Pages: 37 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2021 )