Details
- Title: 2021 IEEE International Conference on Software Engineering and Artificial Intelligence (SEAI 2021)
- Date/Location: Held 11-13 June 2021, Xiamen, China.
- IEEE #: CFP21AC9-POD
- ISBN: 9781665448031
- Pages: 90 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2021 )
Description
Members/Attendees
Tab 4
- Title: 2021 IEEE International Conference on Software Engineering and Artificial Intelligence (SEAI 2021)
- Date/Location: Held 11-13 June 2021, Xiamen, China.
- IEEE #: CFP21AC9-POD
- ISBN: 9781665448031
- Pages: 90 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2021 )