Details
- Title: 2021 IEEE/ACM International Conference on Technical Debt (TechDebt 2021)
- Date/Location: Held 22-30 May 2021, Virtual Conference.
- IEEE #: CFP21P50-POD
- ISBN: 9781665414067
- Pages: 115 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2021 )
Description
Members/Attendees
Tab 4
- Title: 2021 IEEE/ACM International Conference on Technical Debt (TechDebt 2021)
- Date/Location: Held 22-30 May 2021, Virtual Conference.
- IEEE #: CFP21P50-POD
- ISBN: 9781665414067
- Pages: 115 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2021 )