Details
- Title: 2021 IEEE/ACM 8th International Conference on Mobile Software Engineering and Systems (MobileSoft 2021)
- Date/Location: Held 17-19 May 2021, Madrid, Spain.
- IEEE #: CFP21D49-POD
- ISBN: 9781665429863
- Pages: 99 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2021 )
Description
Members/Attendees
Tab 4
- Title: 2021 IEEE/ACM 8th International Conference on Mobile Software Engineering and Systems (MobileSoft 2021)
- Date/Location: Held 17-19 May 2021, Madrid, Spain.
- IEEE #: CFP21D49-POD
- ISBN: 9781665429863
- Pages: 99 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2021 )