Details
- Title: 2021 International Conference on Electronics Packaging (ICEP 2021)
- Date/Location: Held 12-14 May 2021, Tokyo, Japan.
- IEEE #: CFP2189U-POD
- ISBN: 9781665448390
- Pages: 192 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2021 )
Description
Members/Attendees
Tab 4
- Title: 2021 International Conference on Electronics Packaging (ICEP 2021)
- Date/Location: Held 12-14 May 2021, Tokyo, Japan.
- IEEE #: CFP2189U-POD
- ISBN: 9781665448390
- Pages: 192 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2021 )