Details
- Title: 2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD 2021)
- Date/Location: Held 30 May - 3 June 2021, Virtual Conference.
- IEEE #: CFP21ISP-POD
- ISBN: 9781728189857
- Pages: 402 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2021 )
Description
Members/Attendees
Tab 4
- Title: 2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD 2021)
- Date/Location: Held 30 May - 3 June 2021, Virtual Conference.
- IEEE #: CFP21ISP-POD
- ISBN: 9781728189857
- Pages: 402 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2021 )