Details
- Title: 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2020)
- Date/Location: Held 14 September - 9 October 2020, Berlin, Germany.
- IEEE #: CFP20TII-POD
- ISBN: 9781728176444
- Pages: 322 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2021 )
Description
Members/Attendees
Tab 4
- Title: 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2020)
- Date/Location: Held 14 September - 9 October 2020, Berlin, Germany.
- IEEE #: CFP20TII-POD
- ISBN: 9781728176444
- Pages: 322 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2021 )