THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 22ND 2021. (EuroSimE 2021)

Item #:

058817

$123.00 - $246.00

Details

Title: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2021)
Date/Location: Held 19-21 April 2021, St. Julian, Malta.
IEEE #: CFP21566-POD
ISBN: 9781665413749
Pages: 403 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Jul 2021 )

Title: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2021)
Date/Location: Held 19-21 April 2021, St. Julian, Malta.
IEEE #: CFP21566-POD
ISBN: 9781665413749
Pages: 403 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Jul 2021 )