ELECTRONICS, CIRCUITS AND INFORMATION ENGINEERING. INTERNATIONAL CONFERENCE. 2021. (ECIE 2021)

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058774
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Details

  • Title: 2021 International Conference on Electronics, Circuits and Information Engineering (ECIE 2021)
  • Date/Location: Held 22-24 January 2021, Zhengzhou, China.
  • IEEE #: CFP21AE2-POD
  • ISBN: 9781665448109
  • Pages: 380 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jul 2021 )

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Tab 4

 
  • Title: 2021 International Conference on Electronics, Circuits and Information Engineering (ECIE 2021)
  • Date/Location: Held 22-24 January 2021, Zhengzhou, China.
  • IEEE #: CFP21AE2-POD
  • ISBN: 9781665448109
  • Pages: 380 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jul 2021 )