Details
- Title: 2021 14th International Congress Molded Interconnect Devices (MID 2021)
- Date/Location: Held 8-11 February 2021, Virtual Conference.
- IEEE #: CFP21J74-POD
- ISBN: 9781728175102
- Pages: 103 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2021 )
Description
Members/Attendees
Tab 4
- Title: 2021 14th International Congress Molded Interconnect Devices (MID 2021)
- Date/Location: Held 8-11 February 2021, Virtual Conference.
- IEEE #: CFP21J74-POD
- ISBN: 9781728175102
- Pages: 103 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2021 )