ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS. IEEE. 2020. (EDAPS 2020) (USB)

ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS. IEEE. 2020. (EDAPS 2020) (USB)

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057540
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Details

  • Title: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS 2020)
  • Date/Location: Held 14-16 December 2020, Shenzhen, China.
  • IEEE #: CFP20EDP-USB
  • ISBN: 9781728194110
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2021 )

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  • Title: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS 2020)
  • Date/Location: Held 14-16 December 2020, Shenzhen, China.
  • IEEE #: CFP20EDP-USB
  • ISBN: 9781728194110
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2021 )