Details
- Title: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS 2020)
- Date/Location: Held 14-16 December 2020, Shenzhen, China.
- IEEE #: CFP20EDP-POD
- ISBN: 9781728194134
- Pages: 117 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2021 )
Description
Members/Attendees
Tab 4
- Title: 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS 2020)
- Date/Location: Held 14-16 December 2020, Shenzhen, China.
- IEEE #: CFP20EDP-POD
- ISBN: 9781728194134
- Pages: 117 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2021 )