Details
- Title: 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME 2020)
- Date/Location: Held 21-24 October 2020, Pitesti, Romania.
- IEEE #: CFP2007I-POD
- ISBN: 9781728175072
- Pages: 443 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2021 )
Description
Members/Attendees
Tab 4
- Title: 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME 2020)
- Date/Location: Held 21-24 October 2020, Pitesti, Romania.
- IEEE #: CFP2007I-POD
- ISBN: 9781728175072
- Pages: 443 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2021 )