Details
- Title: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2020)
- Date/Location: Held 21-23 October 2020, Taipei, Taiwan.
- IEEE #: CFP2059B-POD
- ISBN: 9781728198521
- Pages: 307 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2021 )
Description
Members/Attendees
Tab 4
- Title: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2020)
- Date/Location: Held 21-23 October 2020, Taipei, Taiwan.
- IEEE #: CFP2059B-POD
- ISBN: 9781728198521
- Pages: 307 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2021 )