Details
- Title: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2020)
- Date/Location: Held 20-23 July 2020, Singapore.
- IEEE #: CFP20777-POD
- ISBN: 9781728161709
- Pages: 503 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2021 )
Description
Members/Attendees
Tab 4
- Title: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2020)
- Date/Location: Held 20-23 July 2020, Singapore.
- IEEE #: CFP20777-POD
- ISBN: 9781728161709
- Pages: 503 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2021 )