Details
- Title: Semiconductor Wafer Bonding: Science, Technology and Applications 16
- Subtitle: PRiME 2020 - Held online due to COVID 19
- Date/Location: Held 4-9 October 2020, Honolulu, Hawaii, USA.
- Series: ECS Transactions Volume 98 No.04
- Editor: Knechtel, R. et al.
- ISBN: 9781713819363
- Pages: 225 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Nov 2020 )
Description
Members/Attendees
Tab 4
- Title: Semiconductor Wafer Bonding: Science, Technology and Applications 16
- Subtitle: PRiME 2020 - Held online due to COVID 19
- Date/Location: Held 4-9 October 2020, Honolulu, Hawaii, USA.
- Series: ECS Transactions Volume 98 No.04
- Editor: Knechtel, R. et al.
- ISBN: 9781713819363
- Pages: 225 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Nov 2020 )