Details
- Title: 2020 IEEE Midwest Industry Conference (MIC 2020)
- Date/Location: Held 7-8 August 2020, Champaign, Illinois, USA.
- IEEE #: CFP20X25-POD
- ISBN: 9781728183879
- Pages: 30 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2020 )
Description
Members/Attendees
Tab 4
- Title: 2020 IEEE Midwest Industry Conference (MIC 2020)
- Date/Location: Held 7-8 August 2020, Champaign, Illinois, USA.
- IEEE #: CFP20X25-POD
- ISBN: 9781728183879
- Pages: 30 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2020 )