Details
- Title: 2020 21st International Conference on Electronic Packaging Technology (ICEPT 2020)
- Date/Location: Held 12-15 August 2020, Guangzhou, China.
- IEEE #: CFP20553-POD
- ISBN: 9781728168272
- Pages: 1,519 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2021 )
Description
Members/Attendees
Tab 4
- Title: 2020 21st International Conference on Electronic Packaging Technology (ICEPT 2020)
- Date/Location: Held 12-15 August 2020, Guangzhou, China.
- IEEE #: CFP20553-POD
- ISBN: 9781728168272
- Pages: 1,519 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2021 )