THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. IEEE INTERSOCIETY CONFERENCE. 19TH 2020. (ITherm 2020) (2 VOLS)

THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. IEEE INTERSOCIETY CONFERENCE. 19TH 2020. (ITherm 2020) (2 VOLS)

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055767
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  • Title: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2020)
  • Date/Location: Held 21-23 July 2020, Orlando, Florida, USA.
  • IEEE #: CFP20ITH-POD
  • ISBN: 9781728197654
  • Pages: 1,423 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Feb 2021 )

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  • Title: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2020)
  • Date/Location: Held 21-23 July 2020, Orlando, Florida, USA.
  • IEEE #: CFP20ITH-POD
  • ISBN: 9781728197654
  • Pages: 1,423 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Feb 2021 )