Details
- Title: 2020 43rd International Conference on Telecommunications and Signal Processing (TSP 2020)
- Date/Location: Held 7-9 July 2020, Milan, Italy.
- IEEE #: CFP2088P-POD
- ISBN: 9781728163772
- Pages: 702 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2020 )
Description
Members/Attendees
Tab 4
- Title: 2020 43rd International Conference on Telecommunications and Signal Processing (TSP 2020)
- Date/Location: Held 7-9 July 2020, Milan, Italy.
- IEEE #: CFP2088P-POD
- ISBN: 9781728163772
- Pages: 702 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2020 )