Details
- Title: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2020)
- Date/Location: Held 6-27 July 2020, Cracow, Poland.
- IEEE #: CFP20566-POD
- ISBN: 9781728160504
- Pages: 395 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2020 )
Description
Members/Attendees
Tab 4
- Title: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2020)
- Date/Location: Held 6-27 July 2020, Cracow, Poland.
- IEEE #: CFP20566-POD
- ISBN: 9781728160504
- Pages: 395 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2020 )