Details
- Title: 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2020)
- Date/Location: Held 15-26 June 2020, Lyon, France.
- IEEE #: CFP20DTI-POD
- ISBN: 9781728189024
- Pages: 145 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2020 )
Description
Members/Attendees
Tab 4
- Title: 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2020)
- Date/Location: Held 15-26 June 2020, Lyon, France.
- IEEE #: CFP20DTI-POD
- ISBN: 9781728189024
- Pages: 145 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2020 )