Details
- Title: 2020 IEEE Technology & Engineering Management Conference (TEMSCON 2020)
- Date/Location: Held 3-6 June 2020, Novi, Michigan, USA.
- IEEE #: CFP20G19-POD
- ISBN: 9781728142258
- Pages: 197 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2020 )
Description
Members/Attendees
Tab 4
- Title: 2020 IEEE Technology & Engineering Management Conference (TEMSCON 2020)
- Date/Location: Held 3-6 June 2020, Novi, Michigan, USA.
- IEEE #: CFP20G19-POD
- ISBN: 9781728142258
- Pages: 197 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2020 )