Details
- Title: 2020 3rd International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2020)
- Date/Location: Held 24-26 April 2020, Shenzhen, China.
- IEEE #: CFP20Y18-POD
- ISBN: 9781728181448
- Pages: 962 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2020 )
Description
Members/Attendees
Tab 4
- Title: 2020 3rd International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2020)
- Date/Location: Held 24-26 April 2020, Shenzhen, China.
- IEEE #: CFP20Y18-POD
- ISBN: 9781728181448
- Pages: 962 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2020 )