PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS. INTERNATIONAL TECHNICAL CONFERENCE. 2019. (InterPACK 2019)

PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS. INTERNATIONAL TECHNICAL CONFERENCE. 2019. (InterPACK 2019)

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  • Title: INTERNATIONAL TECHNICAL CONFERENCE ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS
  • Subtitle: InterPACK2019
  • Date/Location: Held 7-9 October 2019, Anaheim, California, USA.
  • ISBN: 9780791859322
  • Pages: 774 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: American Society of Mechanical Engineers (ASME)
  • POD Publisher: Curran Associates, Inc. ( Jul 2020 )

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Tab 4

 
  • Title: INTERNATIONAL TECHNICAL CONFERENCE ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS
  • Subtitle: InterPACK2019
  • Date/Location: Held 7-9 October 2019, Anaheim, California, USA.
  • ISBN: 9780791859322
  • Pages: 774 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: American Society of Mechanical Engineers (ASME)
  • POD Publisher: Curran Associates, Inc. ( Jul 2020 )