Details
- Title: 2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME 2020)
- Date/Location: Held 1-3 May 2020, Suzhou, China.
- IEEE #: CFP20Y22-POD
- ISBN: 9781728181462
- Pages: 747 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2020 )
Description
Members/Attendees
Tab 4
- Title: 2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME 2020)
- Date/Location: Held 1-3 May 2020, Suzhou, China.
- IEEE #: CFP20Y22-POD
- ISBN: 9781728181462
- Pages: 747 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2020 )