SEMICONDUCTOR PACKAGING ROADMAP SYMPOSIUM. 2016. MEPTEC INITIATES COLLABORATION WITH HETEROGENEOUS INTEGRATION ROADMAP

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054738

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Title: Semiconductor Packaging Roadmap Symposium 2016
Subtitle: MEPTEC Initiates Collaboration with Heterogeneous Integration Roadmap
Date/Location: Held 14 November 2016, San Jose, California, USA.
Series: MEPTEC Symposium Proceedings Number 62
ISBN: 9781713812869
Pages: 177 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
POD Publisher: Curran Associates, Inc. ( Jan 2021 )

Title: Semiconductor Packaging Roadmap Symposium 2016
Subtitle: MEPTEC Initiates Collaboration with Heterogeneous Integration Roadmap
Date/Location: Held 14 November 2016, San Jose, California, USA.
Series: MEPTEC Symposium Proceedings Number 62
ISBN: 9781713812869
Pages: 177 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Microelectronics Packaging and Test Engineering Council (MEPTEC)
POD Publisher: Curran Associates, Inc. ( Jan 2021 )