ELECTRONIC PACKAGING INTERCONNECT TECHNOLOGY SYMPOSIUM. 2019. (EPITS 2019)

ELECTRONIC PACKAGING INTERCONNECT TECHNOLOGY SYMPOSIUM. 2019. (EPITS 2019)

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054246
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Details

  • Title: Electronic Packaging Interconnect Technology Symposium (EPITS 2019)
  • Date/Location: Held 24-25 November 2019, Penang, Malaysia.
  • Series: IOP Conference Series: Materials Science and Engineering Volume 701
  • ISBN: 9781713810315
  • Pages: 422 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Physics Publishing (IOP)
  • POD Publisher: Curran Associates, Inc. ( Dec 2020 )

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  • Title: Electronic Packaging Interconnect Technology Symposium (EPITS 2019)
  • Date/Location: Held 24-25 November 2019, Penang, Malaysia.
  • Series: IOP Conference Series: Materials Science and Engineering Volume 701
  • ISBN: 9781713810315
  • Pages: 422 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Physics Publishing (IOP)
  • POD Publisher: Curran Associates, Inc. ( Dec 2020 )