Details
- Title: 2019 20th International Conference on Electronic Packaging Technology(ICEPT 2019)
- Date/Location: Held 12-15 August 2019, Hong Kong, China.
- IEEE #: CFP19553-POD
- ISBN: 9781728150659
- Pages: 913 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 20th International Conference on Electronic Packaging Technology(ICEPT 2019)
- Date/Location: Held 12-15 August 2019, Hong Kong, China.
- IEEE #: CFP19553-POD
- ISBN: 9781728150659
- Pages: 913 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2020 )