Details
- Title: 2019 IEEE Symposium on High-Performance Interconnects (HOTI 2019)
- Date/Location: Held 14-16 August 2019, Santa Clara, California, USA.
- IEEE #: CFP19HIS-POD
- ISBN: 9781728155265
- Pages: 69 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE Symposium on High-Performance Interconnects (HOTI 2019)
- Date/Location: Held 14-16 August 2019, Santa Clara, California, USA.
- IEEE #: CFP19HIS-POD
- ISBN: 9781728155265
- Pages: 69 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2020 )