E-MANUFACTURING AND DESIGN COLLABORATION. JOINT INTERNATIONAL SYMPOSIUM. 2019. (EMDC 2019) (AND SEMICONDUCTOR MANUFACTURING - ISSM 2019)

E-MANUFACTURING AND DESIGN COLLABORATION. JOINT INTERNATIONAL SYMPOSIUM. 2019. (EMDC 2019) (AND SEMICONDUCTOR MANUFACTURING - ISSM 2019)

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053774
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Details

  • Title: 2019 Joint International Symposium on e-Manufacturing & Design Collaboration (eMDC 2019) & Semiconductor Manufacturing (ISSM 2019)
  • Date/Location: Held 6 September 2019, Hsinchu, Taiwan.
  • IEEE #: CFP19SSM-POD
  • ISBN: 9781728143705
  • Pages: 58 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( May 2020 )

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Tab 4

 
  • Title: 2019 Joint International Symposium on e-Manufacturing & Design Collaboration (eMDC 2019) & Semiconductor Manufacturing (ISSM 2019)
  • Date/Location: Held 6 September 2019, Hsinchu, Taiwan.
  • IEEE #: CFP19SSM-POD
  • ISBN: 9781728143705
  • Pages: 58 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( May 2020 )