Details
- Title: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2019)
- Date/Location: Held 23-25 October 2019, Taipei, Taiwan.
- IEEE #: CFP1959B-POD
- ISBN: 9781728160719
- Pages: 196 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2019)
- Date/Location: Held 23-25 October 2019, Taipei, Taiwan.
- IEEE #: CFP1959B-POD
- ISBN: 9781728160719
- Pages: 196 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2020 )