Details
- Title: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC 2019)
- Date/Location: Held 4-6 December 2019, Singapore.
- IEEE #: CFP19453-POD
- ISBN: 9781728138367
- Pages: 785 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC 2019)
- Date/Location: Held 4-6 December 2019, Singapore.
- IEEE #: CFP19453-POD
- ISBN: 9781728138367
- Pages: 785 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2020 )