ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS. 2019. (EDAPS 2019) (USB)

ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS. 2019. (EDAPS 2019) (USB)

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053085
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Details

  • Title: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS 2019)
  • Date/Location: Held 16-18 December 2019, Kaohsiung, Taiwan.
  • IEEE #: CFP19EDP-USB
  • ISBN: 9781728124315
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jun 2020 )

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Tab 4

 
  • Title: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS 2019)
  • Date/Location: Held 16-18 December 2019, Kaohsiung, Taiwan.
  • IEEE #: CFP19EDP-USB
  • ISBN: 9781728124315
  • Format: USB
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Jun 2020 )